发明名称 High-PTF sputtering targets and method of manufacturing
摘要 A target for a deposition apparatus is formed by blending at least two different types of powders together and consolidating the powders with a powder metallurgy process to form a billet. The target is then formed from the billet. The target includes a first material phase having a first PTF and a second material phase having a second PTF higher than the first PTF. The second PTF is also higher than a PTF of a material having the same chemistry as the target.
申请公布号 US2003228238(A1) 申请公布日期 2003.12.11
申请号 US20020163620 申请日期 2002.06.07
申请人 ZHANG WENJUN;KUNKEL BERND;DEODUTT ANAND;BARTHOLOMEUSZ MICHAEL 发明人 ZHANG WENJUN;KUNKEL BERND;DEODUTT ANAND;BARTHOLOMEUSZ MICHAEL
分类号 B22F1/00;C23C14/34;G11B5/851;(IPC1-7):B22F1/00 主分类号 B22F1/00
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