发明名称 |
WEB PAD DESIGN FOR CHEMICAL MECHANICAL POLISHING |
摘要 |
<p>An article and method are provided for polishing a substrate surface. In one aspect, the invention provides polishing articles including a linear strip of backing material and a fibrous polishing material disposed on the backing material. The polishing material may be in the form of individual fibers, a mesh of fibers, a web of fibers, an interwoven cloth of fibers, or felt. The polishing material may be impregnated or coated with a polishing enhancing material. The polishing article may be disposed in an apparatus for processing a substrate on a platen. In operation, a substrate is contacted with the polishing article and relative motion is provided between the substrate and the polishing article to remove material from the substrate surface.</p> |
申请公布号 |
WO03101669(A1) |
申请公布日期 |
2003.12.11 |
申请号 |
WO2003US17052 |
申请日期 |
2003.05.30 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HSU, WEI-YUNG;MA, YUTAO;KO, SEN-HOU;CARL, DANIEL, A. |
分类号 |
B24B37/24;B24D3/28;B24D11/00;(IPC1-7):B24D3/28;B24B7/22;B24B37/04 |
主分类号 |
B24B37/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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