APPARATUS AND METHOD FOR INSPECTING ADHERING STATE OF PCB FOR BGA TYPE CHIP

摘要

PURPOSE: An apparatus and a method for inspecting an adhering state of a PCB(Printed Circuit Board) for BGA(Ball Grid Array) type chip are provided to decide the adhering state of balls on the PCB by utilizing an electrostatic discharge protection circuit. CONSTITUTION: An apparatus and a method for inspecting an adhering state of a PCB for BGA type chip includes a contact module(60), a measurement unit(64), and a decision unit(65). The contact module(60) includes a plurality of lead pins(69) which are inserted into a plurality of connection holes(61) of a PCB in order to be electrically connected to balls. The measurement unit(64) measures the electrical potential between the lead pins(69) and the ground. The decision unit(65) decides an adhering state of the balls on the PCB by using the measured electrical potential.