发明名称 FERROELECTRIC MEMORY INTEGRATED CIRCUIT WITH IMPROVED RELIABILITYAND DENSITY
摘要 <p>An IC with memory cells arranged in a chained architecture is disclosed. The top local interconnect between the top capacitor electrodes and active area is achieved by using a strap. The use of a strap eliminates the need for additional metal layer which reduces manufacturing costs. Furthermore, sidewall spacers are used to isolate the strap from the different layers of the capacitors. The use of spacers advantageously enables the strap to be self-aligned.</p>
申请公布号 WO2003102957(P1) 申请公布日期 2003.12.11
申请号 EP2003005858 申请日期 2003.06.04
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