| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a stage which enables the highly accurate junction of a semiconductor element and substrate constitution which is designed to have an electrode arranged at high density in a semiconductor element and a substrate in a bonding stage used as a pressure bonding stage when the semiconductor element is mounted on the substrate or the like. <P>SOLUTION: The upper surface of a stage in contact with a semiconductor element is constituted of a substance of high thermal conductivity and has favorable in-plane temperature distribution. The outer circumferential part of a stage body is constituted of a material of low thermal conductivity so that heat radiation to a peripheral component is restrained. Moreover, a material of low wettability to a resin material is used for a stage surface so that the resin material hardly attaches to the stage during operation and attached resin can be removed easily. <P>COPYRIGHT: (C)2004,JPO</p> |
