Self-adhering thermal interface material

摘要

Disclosed is a thermal interface composition which undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source to a heat sink, the composition comprising: (A) a viscoelastic composition which softens at about the operating temperature of the heat source, the viscoelastic composition comprising: (1) a thermoplastic elastomer, (2) a compatible hydrocarbon oil, and (3) a tackifying resin; (B) a dispersing agent; and (C) a thermally conductive filler dispersed within the viscoelastic composition. Also disclosed is a method for making the thermal interface composition.