Light emitting semiconductor device

摘要

Disclosed is a light emitting semiconductor device which contains LED chip(s) wherein semiconductor layer(s) comprising P-N junction(s) is or are laminated over substrate(s) and which is equipped with support structure(s) providing electrical continuity to such LED chip(s), such LED chip(s) being covered by resin. Such LED chip(s) is or are secured by way of intervening first resin(s) to mounting surface(s) of the support structure(s) and is or are covered by second resin(s). First resins(s) and second resin(s) are the same resin(s).