发明名称 |
Chemical mechanical polishing apparatus having a measuring device for measuring a guide ring |
摘要 |
A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.
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申请公布号 |
US2003229468(A1) |
申请公布日期 |
2003.12.11 |
申请号 |
US20030410558 |
申请日期 |
2003.04.07 |
申请人 |
NANYA TECHNOLOGY CORPORATION |
发明人 |
CHEN CHIH-KUN;WANG SHAN-CHANG;CHEN CHING-HUANG |
分类号 |
B24B49/00;(IPC1-7):G06F15/00 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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