发明名称 |
Method for inspecting wafer defects of a semiconductor device |
摘要 |
Disclosed is a method for inspecting defects of a wafer of a semiconductor device, wherein the wafer is set up with reference coordinates for a respective die so that inspection time is reduced and the defects are classified by the respective die. The method may be carried out by a defect analysis system comprising an inspection station for inspecting defects of the wafer and a review station for precisely re-inspecting defects. The method includes the steps of: providing the respective die with a serial number, the plural dies being formed on the wafer; and setting up coordinates for a plane of the respective die based on one edge of the die as reference point.
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申请公布号 |
US2003229457(A1) |
申请公布日期 |
2003.12.11 |
申请号 |
US20030458871 |
申请日期 |
2003.06.11 |
申请人 |
LEE HYUN BAE;CHOI JUNG HWAN;KIM JEONG HUN |
发明人 |
LEE HYUN BAE;CHOI JUNG HWAN;KIM JEONG HUN |
分类号 |
G01N21/95;G06F19/00;H01L21/66;(IPC1-7):G06F19/00 |
主分类号 |
G01N21/95 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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