| 发明名称 |
Polyamide resin composition |
| 摘要 |
A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270° C. to 340° C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) where R<1 >and R<2 >are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.
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| 申请公布号 |
US2003229162(A1) |
申请公布日期 |
2003.12.11 |
| 申请号 |
US20030413551 |
申请日期 |
2003.04.15 |
| 申请人 |
KURARAY CO. LTD.;ASAHI DENKA CO., LTD. |
发明人 |
MATSUOKA HIDEHARU;OKA HIDEAKI;UCHIDA KOICHI;TSUZUKI MASAHIDE;BEPPU KOJI |
| 分类号 |
C08K3/00;C08K5/00;C08K5/03;C08K5/103;C08L77/00;C08L77/02;C08L77/06;(IPC1-7):C08L77/00 |
主分类号 |
C08K3/00 |
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