发明名称 TEMPERATURE CONTROL APPARATUS OF SEMICONDUCTOR MANUFACTURING BAKE
摘要 PURPOSE: A temperature control apparatus of a semiconductor manufacturing bake is provided to be capable of previously recognizing a disturbance generation signal for preventing the influence due to the generation of disturbance. CONSTITUTION: A temperature control apparatus of a semiconductor manufacturing bake is provided with a disturbance signal generator(30) for generating a disturbance signal when recognizing the generation of disturbance, a subtractor(32) for outputting an error value of 'f(t)' according to a feed-back output value and a temperature compensating input value, and a PID(Proportional Integral Derivative) controller(34) for controlling the temperature of a bake(36). At this time, the bake is used for hardening a wafer at a predetermined temperature by using the temperature control signal of the PID controller. The temperature control apparatus further includes a feedback circuit(38).
申请公布号 KR20030093413(A) 申请公布日期 2003.12.11
申请号 KR20020030964 申请日期 2002.06.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SUL, SEUNG U
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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