发明名称 Enhanced heat transfer structure with heat transfer members of variable density
摘要 A heat transfer structure includes a heat transfer module having a plurality of heat transfer members in the duct chamber with the density increased in the direction of the flow of the coolant and having a greatest density adjacent to the position of a heat source attached in thermal contact with the heat transfer module. The profile of the duct chamber is adjusted to the position of the heat source to increase the velocity of coolant directly under the heat source and to partially or completely block the coolant flow to the areas which do not need to be temperature adjusted. The heat transfer members may be formed as pin fins fabricated from springs compressed to a predetermined density in a direction perpendicular to the longitudinal axis of the spring (and/or in parallel to the longitudinal axis of the heat transfer module).
申请公布号 US2003227732(A1) 申请公布日期 2003.12.11
申请号 US20030434071 申请日期 2003.05.09
申请人 DESSIATOUN SERGUEI V.;IVAKHNENKO IGOR 发明人 DESSIATOUN SERGUEI V.;IVAKHNENKO IGOR
分类号 H01L23/427;H01L23/473;H05K7/20;(IPC1-7):H02H5/04 主分类号 H01L23/427
代理机构 代理人
主权项
地址