Electronic driver device has different components within driver end stage IC and second IC manufactured via differing semiconductor technologies

摘要

The driver device (20) has driver components (25,26) within a driver end stage IC (27) and further components (28,29) within a second IC manufactured using a different semiconductor technology. The second IC may incorporate a multiplexer (22) together with a pair of resistors, with a chip-on-chip technique used for combining the IC's. An Independent claim for a manufacturing method for an electronic driver device is also included.