发明名称 PROCESS FOR CLEANING AND REPASSIVATING SEMICONDUCTOR EQUIPMENT PARTS
摘要 <p>A wet cleaning/passivation process for a passivatable metal part including a contiminant-bearing surface. The process includes the steps of: (a) contacting the contaminant-bearing part with an aqueous acid solution effective for pickling the contaminant-bearing surface of the contaminant-bearing part, with such contacting being conducted for sufficient time and at sufficient temperature to achieve pickling of the contaminant-bearing surface; (b) contacting the cleaned surface of the part with a passivating aqueous solution, with such contacting being conducted for sufficient time and at sufficient temperature to passivate the cleaned surface; and (c) CO2 blasting the surface, to remove micron and sub-micron particles from the surface.</p>
申请公布号 WO2003101762(P1) 申请公布日期 2003.12.11
申请号 US2002016670 申请日期 2002.05.28
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