发明名称 HEATER CONFIGURATION FOR TRI-COLOR HEATER CHIP
摘要 <p>A heater chip (25) has a substrate (34) with one inner (32) and two outer vias (30) adjacently arranged. Each via has a first (64) and second longitudinal side (66). A plurality of heater, formed by thin film layers (104, 112), are grouped together in six rows where two of the six rows are arranged adjacent to the first longitudinal side of one of the two outer vias, two rows are arranged adjacent to either the first or second longitudinal side of the inner via, and two rows are arranged adjacent to the second longitudinal side of the other of the two outer vias. Each of the first, second, and third rows have one row of near heaters (B, D, E) and one row of far heaters (A, C, F). The near heaters are closer in distance to their respective ink via than the far heaters. Printheads containing the heater chip and printers are also disclosed.</p>
申请公布号 WO2003101735(P1) 申请公布日期 2003.12.11
申请号 US2003016674 申请日期 2003.05.28
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