THERMOCONDUCTIVE CURABLE LIQUID POLYMER COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED WITH THE USE OF THIS COMPOSITION
摘要
<p>A thermoconductive curable liquid polymer composition includes (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device has a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.</p>
