发明名称 HIGH-POWER LAND GRID ARRAY PACKAGE AND SOCKET
摘要 <p>A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.</p>
申请公布号 WO03103045(A1) 申请公布日期 2003.12.11
申请号 WO2003US15970 申请日期 2003.05.21
申请人 INTEL CORPORATION 发明人 TRAN, DONALD
分类号 H01L23/498;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/498
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