发明名称 |
Method and apparatus for fabricating bonded substrate |
摘要 |
An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.
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申请公布号 |
US2003226633(A1) |
申请公布日期 |
2003.12.11 |
申请号 |
US20030453654 |
申请日期 |
2003.06.04 |
申请人 |
FUJITSU LIMITED |
发明人 |
MURAMOTO TAKANORI;OHNO TAKUYA;KOMATSU KAZUSHIGE;HASHIZUME KOJI;ADACHI TSUKASA;MIYAJIMA YOSHIMASA;NAKASHIMA KATSUHIRO |
分类号 |
G02F1/13;G02F1/1333;G02F1/1339;(IPC1-7):G02F1/133;B32B31/04;B32B31/20 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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