发明名称 Method and apparatus for fabricating bonded substrate
摘要 An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.
申请公布号 US2003226633(A1) 申请公布日期 2003.12.11
申请号 US20030453654 申请日期 2003.06.04
申请人 FUJITSU LIMITED 发明人 MURAMOTO TAKANORI;OHNO TAKUYA;KOMATSU KAZUSHIGE;HASHIZUME KOJI;ADACHI TSUKASA;MIYAJIMA YOSHIMASA;NAKASHIMA KATSUHIRO
分类号 G02F1/13;G02F1/1333;G02F1/1339;(IPC1-7):G02F1/133;B32B31/04;B32B31/20 主分类号 G02F1/13
代理机构 代理人
主权项
地址