发明名称 |
Wiring substrate, display device, and manufacturing method of wiring substrate |
摘要 |
A wiring substrate is arranged so that a first periphery electric wiring and a second periphery electric wiring are patterned on an active matrix substrate, and a TCP as a electronic component is provided on a portion of the patterned electric wiring. The first periphery electric wiring and the second periphery electric wiring are formed by including a metal thin film and a transferred metal film. Further, in the portion where the TCP is provided, the first periphery electric wiring and the second periphery electric wiring either have a monolayer structure with one of the metal thin film and the transferred metal film, or have a lamination structure with both of the metal thin film and the transferred metal film. On this account, connection failure can be prevented on a low resistance wiring substrate.
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申请公布号 |
US2003227592(A1) |
申请公布日期 |
2003.12.11 |
申请号 |
US20030454580 |
申请日期 |
2003.06.05 |
申请人 |
IZUMI YOSHIHIRO;NAKAGAWA TOSHIHIKO |
发明人 |
IZUMI YOSHIHIRO;NAKAGAWA TOSHIHIKO |
分类号 |
H01L23/48;G02F1/1345;H01L21/60;H05K1/02;H05K1/09;H05K1/14;H05K3/20;H05K3/24;H05K3/32;(IPC1-7):G02F1/134 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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