发明名称 Wiring substrate, display device, and manufacturing method of wiring substrate
摘要 A wiring substrate is arranged so that a first periphery electric wiring and a second periphery electric wiring are patterned on an active matrix substrate, and a TCP as a electronic component is provided on a portion of the patterned electric wiring. The first periphery electric wiring and the second periphery electric wiring are formed by including a metal thin film and a transferred metal film. Further, in the portion where the TCP is provided, the first periphery electric wiring and the second periphery electric wiring either have a monolayer structure with one of the metal thin film and the transferred metal film, or have a lamination structure with both of the metal thin film and the transferred metal film. On this account, connection failure can be prevented on a low resistance wiring substrate.
申请公布号 US2003227592(A1) 申请公布日期 2003.12.11
申请号 US20030454580 申请日期 2003.06.05
申请人 IZUMI YOSHIHIRO;NAKAGAWA TOSHIHIKO 发明人 IZUMI YOSHIHIRO;NAKAGAWA TOSHIHIKO
分类号 H01L23/48;G02F1/1345;H01L21/60;H05K1/02;H05K1/09;H05K1/14;H05K3/20;H05K3/24;H05K3/32;(IPC1-7):G02F1/134 主分类号 H01L23/48
代理机构 代理人
主权项
地址