发明名称 Integrated circuit layout and a semiconductor device manufactured using the same
摘要 An integrated circuit layout and a semiconductor device manufactured using the same are provided. According to one embodiment, a semiconductor device has a substrate and a plurality of bar type patterns on the substrate. The bar type patterns are substantially parallel to each other. At least one of the bar type patterns includes first and second ends and a middle part therebetween. The bar type patterns has an overhang at the first end thereof. The bar type patterns may be gate patterns, bit line patterns or active patterns.
申请公布号 US2003227063(A1) 申请公布日期 2003.12.11
申请号 US20030376465 申请日期 2003.02.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SEL JONG-SUN;KIM HONG-SOO;CHOI JUNG-DAL
分类号 H01L21/8247;H01L27/02;H01L27/04;H01L27/115;(IPC1-7):H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119 主分类号 H01L21/8247
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