| 摘要 |
A semiconductor chip mounted on a flat package has two functions. The semiconductor chip has a function selecting pad supplied with a selection voltage for selecting a function. The semiconductor chip also has voltage pads for outputting function selecting voltages. Thereby the selection of a function is enabled by bonding connection such that the voltage of the voltage pad or the voltage pad is inputted to the function selecting pad via a lead frame. Thus the function can be selected and determined by the bonding connection at the time of fabrication.
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