SOLDER PRINTING USING A STENCIL HAVING A REVERSE-TAPERED APERTURE

摘要

A stencil (18) used for printing solder paste (14) on a contact pad (20) of a printed wiring board (22) has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (18) (i.e., where solder paste (14) enters the apertures) than at the board side of the stencil (18) (i.e., where the stencil contacts the contact pad (20) of the printed wiring board (22).