| 摘要 |
<p>A method of cleaning a semiconductor fabrication processing chamber (11) involves recirculation of cleaning gas components. Consequently, input cleaning gas is utilized efficiently, and undesirable emissions are reduced. The method includes flowing a cleaning gas to an inlet (12) of a processing chamber (11), and exposing surfaces of the processing chamber (11) to the cleaning gas to clean the surfaces, thereby producing a reaction product. The method further includes removing an outlet (13) gas including the reaction product from an outlet of the processing chamber (11), separating at least a portion of the reaction product from the outlet gas, and recirculating a portion of the outlet gas to the inlet (12) the processing chamber (11).</p> |
