| 摘要 |
Microvia Conductor Prepreg Layer (MCPL) for the production of high-density interconnection (HDI) multilayers and optoelectronic circuit elements, especially by compressing separate layers, comprises copper foil (1) (preferably 5-35 microns thick) laminated with non-woven glass fabric (12) (20-200 microns thick) which is coated with epoxy resin dielectric (13). Independent claims are also included for (1) (1) a method for the production of MCPL by coating a solvent-containing dielectric (13) onto a glass nonwoven-covered copper foil (1) at room temperature on a roller-coating system (3), passing the coated foil on a conveyor belt (11) through a dryer (10) to remove solvent etc. and laminating with a film (14) on a laminator (4) in such a way that all the air is pressed out (2) (2) apparatus for the production of MCPL, comprising a roller-coating system (2) consisting of a coating unit (3) and a laminating unit (4) with a rubber-coated feed roller (8) and a chromium-plated laminating roller (9) (for laminating with release film from roller (14)), feed rollers (7) with a belt (11) which takes over transport in the dryer (10), a feed roller (8) for the materials to be coated (copper foil (1) and non-woven (12)), a smooth rubber coating (6) on the coating roller, and an air-cooler (16) after the laminating unit (4) .
|
