Polishing pad and process for manufacturing a polishing pad

摘要

The present invention intends to provide a polishing pad and a multi-layer polishing pad (1) that can particularly effectively suppress scratch from occurring. The polishing pad (1) of the invention comprises at least one part selected from a groove (a) having at least one kind of shape selected from annular, lattice-like and spiral form on a polishing surface side, a concave portion (b) and a through hole (c). In the above, surface roughness of an inner surface of the part is 20 mu m or less and the polishing pad (1) is used for chemical mechanical polishing.