| 摘要 |
Method of connecting an integrated circuit with outside electrical leads. The integrated circuit is inserted into an insulating substrate upon which electrical conductance paths are located. An electrical connection is established between the conductor paths on the substrate and the integrated circuit. A hole is etched into the substrate so that the inside ends of the conductor paths protrude freely beyond the edge of the hole. The integrated circuit is inserted into said hole and the ends of the conductor paths extending beyond the edge of the hole establish electrical contact with respective places of the integrated circuit. |
