| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire-bonding device that can immediately inspect a real wire loop which is not affected adversely by vibrations, etc., caused by transportation after bonding is completed by detecting the looped state of a bonded wire, by immediately photographing the state by means of a camera originally held by the device for setting coordinates of bonding positions. SOLUTION: This wire-bonding device photographs the image of parts to be bonded positioned to a boding work performing position with the camera 10, finds the coordinates of bonding positions from the image, and connects the wire 3 to the bonding positions. This device is provided with a means which finds the formula of a straight line passing the two boding positions P1 and P2 found from the image photographed by means of the camera 10 through computation, and a means which finds the length of a perpendicular dropped from the maximum curled point P3 of the loop of the bonded wire 3 to the straight line passing the bonding positions P1 and P2 found from the image through computation. |
