| 发明名称 |
Semiconductor package and method for packaging a semiconductor |
| 摘要 |
<p>Disclosed is a semiconductor package and method for packaging a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on which a circuit pattern and an electrode pad are formed; a second substrate which is adhered to the first substrate and on which a hole is formed; and a solder ball adhered to the electrode pad through the hole formed on the second substrate. Then, the second substrate is used as a solder resist. Accordingly, since the first substrate and the second substrate are formed of same material, the BGA package can be prevented from being cracked and being nonuniform when fired</p> |
| 申请公布号 |
EP1369921(A2) |
申请公布日期 |
2003.12.10 |
| 申请号 |
EP20030012778 |
申请日期 |
2003.06.05 |
| 申请人 |
LG ELECTRONICS INC. |
发明人 |
RYU, JIN HYUNG;CHO, SAM JE |
| 分类号 |
H01L23/48;H01L23/15;H01L23/498;H05K1/03;H05K3/34;H05K3/46;(IPC1-7):H01L23/498 |
主分类号 |
H01L23/48 |
| 代理机构 |
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