Positive photosensitive composition

摘要

The present invention relates to a positive photosensitive composition, and in particular to a material for plate printing for heat mode printing. The positive photosensitive composition of the present invention comprises at least a diazo compound represented by the following General Formula 1, and a water-insoluble but alkaline water-soluble polymer: (where Z represents an organic group in which the pKa of dissociating H in Ph-NH-Z is 14 or less; and Q<1> and Q<2> represent organic groups, where Q<1> and Q<2> may be bonded to form an aliphatic ring or aromatic ring).