| 摘要 |
FIELD: computer engineering. SUBSTANCE: system is implemented in the form of liquid circulation system. One link of system is device absorbing heat that is installed inside computer by gluing to heat forming element. Given system includes one tube as minimum of heat-sink glued to outer side of wall of computer case. EFFECT: effective scattering of heat released in process of operation of computer. 28 cl, 14 dwg |
