发明名称 |
Method for fabricating oxide layers with different thicknesses |
摘要 |
A method for fabricating oxide layers with different thicknesses on a substrate is described. A field oxide layer is formed on the substrate to define a first active region and a second active region therebetween. A first oxide layer is formed over the first active region. A thin oxynitride layer is formed on the first oxide layer. The substrate is oxidized to form a second oxide layer over the second active region, wherein the second oxide layer has a thickness different from the thickness of the first oxide layer,
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申请公布号 |
US6660593(B2) |
申请公布日期 |
2003.12.09 |
申请号 |
US20000747374 |
申请日期 |
2000.12.21 |
申请人 |
WINBOND ELECTRONICS CORP. |
发明人 |
CHIANG SHING-SING;TENG KUO-SHI;YUNG HAO-CHIEH;CHEN YI-SHI |
分类号 |
H01L21/32;H01L21/8234;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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