发明名称 Baffle cooling device
摘要 A device for a component to be cooled includes a baffle cooling plate with at least one leadthrough for the cooling agent, arranged in front of the component. The baffle cooling plate can be impinged upon with a cooling agent. A deviation channel for the cooling agent is provided next to the leadthrough for the cooling agent and between the baffle cooling plate and the component to be cooled. The cooling agent enters the deviation channel after the component has been baffle-cooled. The cooling agent is collected and deviated by way of the deviation channel and can be specifically sued for further cooling purposes. The inventive device provides more efficient baffle cooling.
申请公布号 US6659714(B1) 申请公布日期 2003.12.09
申请号 US20020048822 申请日期 2002.05.22
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 TIEMANN PETER
分类号 F01D9/02;F01D5/18;F01D25/12;F02C7/18;F23R3/00;(IPC1-7):F01D5/14 主分类号 F01D9/02
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