Method of manufacturing via interconnection of glass-ceramic wiring board

摘要

A via interconnection of a glass-ceramic wiring board is made by blending a copper powder to a vehicle including a cellulose derivative, adding a metal oxide powder having a mean particle diameter of from at least 1 mum to at most 4 mum to the vehicle and blending them, adjusting the viscosity of the vehicle by adding the cellulose derivative and filling them to a via; and sintering the via at a temperature of at least 900° C. to at most 1060° C., and forming the via interconnection.