发明名称 Digital temperature sensor (DTS) system to monitor temperature in a memory subsystem
摘要 A memory subsystem package has a memory controller interface ASIC (application specific integrated circuit) and a plurality of memory modules. The ASIC has a bi-directional serial protocol i2C communication bus to off chip drivers for monitoring temperature and for adjusting the environment surrounding the package by controlling fans using fan switches and variable voltage controls. In addition there is provided an Alternating Current Built in Self Test (AC BIST) with variable data receiver voltage reference for performing high-speed AC memory subsystem self-test for that ASIC enabling writing of pseudo-random patterns to memory, reading them back and comparing the expected results at hardware speeds. Vref can be made to vary across its allowable range during AC self test to provide improved coverage. The system monitors Vddq during normal system operation using an ADC. The system varies Vref as a function of Vddq, using a combination of a DAC and ADC. The system varies Vref as a function of Vddq, such that Vref=1/m*Vddq+OFFSET, where m can be 1, 2, 4, or 8, and where OFFSET can be positive or negative ranging from 1/n*Vddq to n-1/n*Vddq, where n is the voltage granularity of the DAC.
申请公布号 US6662136(B2) 申请公布日期 2003.12.09
申请号 US20010829633 申请日期 2001.04.10
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LAMB KIRK D.;GOWER KEVIN C.
分类号 G01K7/42;G11C29/02;G11C29/50;H01L23/34;H01L23/467;H05K7/20;(IPC1-7):G01K1/08 主分类号 G01K7/42
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