发明名称 Electrical fuse for semiconductor integrated circuits
摘要 The present invention relates to a fuse and a method for forming a fuse over a semiconductor substrate. The fuse comprises forming a first contact member and a second contact member over a respective first region and a second region of a patterned, electrically-conductive silicide layer, wherein the first contact member and the second contact member electrically contact the silicide layer, thereby defining a first interface and a second interface, respectively. A first contact area and a second contact area are associated with the respective first contact member and second contact member, wherein the first contact area is larger than the second contact area, thereby defining a fusible link at the second interface. According to one example, the silicide resides over a patterned polysilicon layer, wherein the patterned polysilicon layer generally tapered, and wherein the first region is wider than the second region.
申请公布号 US6661330(B1) 申请公布日期 2003.12.09
申请号 US20020201380 申请日期 2002.07.23
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 YOUNG BRADLEY SCOTT
分类号 H01L23/525;(IPC1-7):H01H85/046;H01H85/02;H01L21/324 主分类号 H01L23/525
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