发明名称 |
High density area array solder microjoining interconnect structure and fabrication method |
摘要 |
A system for interconnecting a set of device chips by means of an array of microjoints disposed on an interconnect carrier is taught. The carrier is provided with a dense array of microjoint receptacles with an adhesion layer, barrier layer and a noble metal layer; the device wafers are fabricated with an array of microjoining pads comprising an adhesion layer, barrier layer and a fusible solder layer with pads being located at matching locations in reference to the barrier receptacles; said device chips are joined to said carrier through the microjoint arrays resulting in interconnections capable of very high input/output density and inter-chip wiring density. |
申请公布号 |
US6661098(B2) |
申请公布日期 |
2003.12.09 |
申请号 |
US20020052620 |
申请日期 |
2002.01.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MAGERLEIN JOHN HAROLD;PETRARCA KEVIN SHAWN;PURUSHOTHAMAN SAMPATH;SAMBUCETTI CARLOS JUAN;VOLANT RICHARD PAUL;WALKER GEORGE FREDERICK |
分类号 |
H01L21/60;H01L21/00;H01L23/485;H01L23/498;H05K1/03;H05K1/11;H05K3/34;H05K3/38;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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