发明名称 Semiconductor device and method of fabricating the same
摘要 A gate electrode <13> is provided to fill up a trench <300> while covering its opening. Assuming that WG represents the diameter (sectional width) of a head portion of the gate electrode <13> located upward beyond a P-type base layer <4> and an N<+>-type emitter diffusion layer <51>, WT represents the diameter (sectional width) of an inner wall of a linearly extending portion of the trench <300> and WC represents the distance between the boundary (the inner wall of the trench 300) between a gate oxide film <11> and the P-type base layer <4> and an end surface of the gate electrode <13> located upward beyond the trench <300> in a section of the trench <300>, relation of either WG>=1.3.WT or WC>=0.2 mum holds between these dimensions.
申请公布号 US6661054(B1) 申请公布日期 2003.12.09
申请号 US19980122094 申请日期 1998.07.24
申请人 发明人
分类号 H01L29/78;H01L21/331;H01L29/06;H01L29/08;H01L29/10;H01L29/423;H01L29/739;(IPC1-7):H01L29/76 主分类号 H01L29/78
代理机构 代理人
主权项
地址