| 摘要 |
PURPOSE: A chip size type semiconductor package is provided to be capable of reducing the size of an electronic instrument. CONSTITUTION: A chip size type semiconductor package is provided with a semiconductor chip(1) having a passivation layer(1a) at its lower surface and a conductive tape(2) attached to the lower portion of the semiconductor chip. At this time, the conductive tape includes a plurality of bumps having the same pattern as an input/output pattern of the semiconductor chip and a copper foil formed at the lower portion of each bump. The chip size type semiconductor package further includes an ACF(Anisotropic Conductive Film)(3) attached to the lower surface of the conductive tape, a substrate(4) attached to the lower surface of the ACF and a coating material part(5) for selectively coating the resultant structure. A plurality of solder balls(4a) are attached to the lower portions of the substrate.
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