FLIP CHIP BONDER AND ALIGNING METHOD THEREOF

摘要

PURPOSE: A flip chip bonder is provided to correctly bond a chip to a substrate even if the chip and the substrate are twisted by correcting the twist of the chip while using a plurality of position aligning marks formed in the chip and the substrate. CONSTITUTION: A plurality of marks are formed in a chip. Marks corresponding to the plurality of marks are formed in the substrate. An XYT stage transfers the substrate. An image photographing unit obtains the image information of the marks in the chip and the substrate. A control unit determines whether the marks are twisted based upon the image information obtained from the image photographing unit and corrects the twist of the marks when the marks are twisted.