发明名称 BONDING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To enable a capillary to be moved vertically relative to a bonding surface and to bond even a work of a wide bonding area. <P>SOLUTION: A device has an ultrasonic horn 20 which is held by a horn holder 14 which is movable in a horizontal direction and tilts downward and forward having a spindle 13 connected to a bonding head 10 rotatively and holds a capillary 21, a link arm 23 which has a spindle 24 connected to the bonding head 10 rotatively having a spindle 22 connected to the horn holder 14 rotatively and a driving motor 30 which moves the spindle 13 horizontally. The spindle 22 is disposed on a line connecting a capillary tip A and the spindle 13. The spindle 24 is disposed on the horizontal line of the spindle 13. They are constituted in a relation of L1=L2=L3, wherein L1 is the length between the spindle 22 and the spindle 24, L2 is the length between the capillary tip A and the spindle 22 and L3 is the length between the spindle 13 and the spindle 22. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347346(A) 申请公布日期 2003.12.05
申请号 JP20020148480 申请日期 2002.05.23
申请人 SHINKAWA LTD 发明人 MAEDA TORU
分类号 H01L21/60;B23K20/00;B23K20/10 主分类号 H01L21/60
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