发明名称 TRANSFERRING METHOD OF ELEMENT, ARRAYING METHOD OF ELEMENT, AND MANUFACTURING METHOD OF IMAGE DISPLAY
摘要 <P>PROBLEM TO BE SOLVED: To provide a transferring method of an element for making uniform the film thickness of resin for covering the element and accurately transferring the element, and to provide an arraying method of an element and a manufacturing method of an image display. <P>SOLUTION: In the transferring method of the element, the element is transferred to an adhesive layer in a semihardening adhesive layer where the viscous property of the surface where the element is adhered is maintained. Then, heat treatment is made to stick the element to the semihardening adhesive layer, thus transferring the element to the adhesive layer having nearly uniform film thickness, and reducing the misalignment of the element. Especially, when a light-emitting device is handles as a chip covered with the adhesive layer, variation in light transmission properties can be reduced, and quality in the image display where the light-emitting device is transferred and packaged or the like can be improved. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347524(A) 申请公布日期 2003.12.05
申请号 JP20020153661 申请日期 2002.05.28
申请人 SONY CORP 发明人 MINAMI MASARU
分类号 G02F1/13;G09F9/00;G09F9/33;H01L21/02;H01L27/12;H01L33/32;H01L33/40;H01L33/48 主分类号 G02F1/13
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