发明名称 CONDUCTIVE BALL MOUNTING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductive ball mounting apparatus in which a suction head is instantaneously elevated upward at almost the same time that the vacuum of the suction head is broken, thereby, a conductive ball is fitted into a suction hole, and a remaining ball is not produced. <P>SOLUTION: Following means are employed in the conductive ball mounting apparatus. First, the apparatus is equipped with the suction head to hold the conductive ball by sucking and an elevating mechanism to elevate the suction head, and the vacuum is broken by applying positive pressure into the suction head in a state that the held conductive ball is mounted on a mounting plate, and then, the suction head is elevated, and the held conductive ball is mounted on the mounting object. Second, the apparatus includes an elevating means independently provided to elevate the suction head further rapidly than the elevating mechanism. Third, the suction head is elevated by the elevating means at almost the same time that the vacuum inside the suction head is broken. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2003347342(A) 申请公布日期 2003.12.05
申请号 JP20020157024 申请日期 2002.05.30
申请人 SHIBUYA KOGYO CO LTD 发明人 TAKADA TSUTOMU;IKEDA KEI
分类号 B23K3/06;H01L21/60;H05K3/34;(IPC1-7):H01L21/60 主分类号 B23K3/06
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