发明名称 HEAT SINK APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve the cooling performance of a heat sink apparatus without increasing the size and the manufacturing cost of the apparatus. SOLUTION: On a surface 10a of a heat sink base 10, a plurality of fins are so formed and an axial flow fan 2 provided oppositely to the surface 10a of the heat sink base 10 is so driven as to pass air through between each pair of fin constituents. Thereby, a element 5 is cooled via a rear surface 10b of the heat sink base 10. Further, in this heat sink apparatus, the fins have small- fin strings 11 in each of which a plurality of fin constituents 11a are so provided in parallel with each other in the state of securing a predetermined clearance 11b between each pair of fin constituents 11a that each small-fin string 11 is extended along the direction of the air flow generated on the surface 10a of the heat sink base 10 when driving the axial flow fan 2. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347779(A) 申请公布日期 2003.12.05
申请号 JP20020152174 申请日期 2002.05.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIMURA SUSUMU;KAGA KUNIHIKO
分类号 H05K7/20;H01L23/40;H01L23/467;(IPC1-7):H05K7/20 主分类号 H05K7/20
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