| 摘要 |
PROBLEM TO BE SOLVED: To provide bonding equipment of an electronic component and a bonding tool which can exchange a contact bonding segment as a separate component, and constitute a vacuum suction system with simple structure. SOLUTION: In the bonding tool which pressure-bonds an electronic component 40 by a load and vibration, a suction part 30 and an engaging member 34 are engaged with the lower part and upper part, respectively, of a through hole 15h which is formed vertically at the center of a born 15, and fastened by using an external thread member 33, thereby forming a sealed internal space 15i inside the through hole 15h. A suction hole 32 opened in a junction acting part 30a communicates with a vacuum port 16a of the horn 15 via the internal space 15i. As a result, the vacuum suction system can be constituted with simple structure without deteriorating the detachable exchangeability of the suction part 30. COPYRIGHT: (C)2004,JPO
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