| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device which has a vialand of a large pattern wherein the adhesion of a vialand part is not deteriorated even in wet treatment, like gold plating, which is liable to damage an interface. SOLUTION: In the tape carrier for a semiconductor device, copper foil is stuck via an adhesive agent to one surface of insulating base substance 5 in which viaholes 1 are formed, a wiring pattern 7 containing vialands 7a on one surface of the base substance 5 is formed by patterning the copper foil, and a conducting layer 4 is formed on the surface of the wiring pattern 7 by electroplating or nonelectrolytic plating. The vialand 7a forming the bottom of the viahole 1 is formed in a polygon, preferably, in a rectangle like a square, thereby increasing an adhesive area to the insulating base substance 5 as compared with a conventional circular land, and increasing adhesion. COPYRIGHT: (C)2004,JPO |
