发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a structure which obtains quality quantum thin lines with ease and enhances the efficiency of semiconductor devices. SOLUTION: A first cladding layer is formed on a semiconductor substrate by epitaxial growth. A striped mask layer is formed on the substrate or the growth layer. Then, vapor phase etching is carried out to form a V-groove without producing an undercut under the mask layer. An active layer and a second cladding layer are grown in the V-groove in this order to obtain a semiconductor device. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347680(A) 申请公布日期 2003.12.05
申请号 JP20030102915 申请日期 2003.04.07
申请人 MITSUBISHI CHEMICALS CORP 发明人 SHIMOYAMA KENJI;KIYOMI KAZUMASA;GOTO HIDEKI
分类号 H01L29/06;H01L21/205;H01S5/343;(IPC1-7):H01S5/343 主分类号 H01L29/06
代理机构 代理人
主权项
地址