发明名称 COIL DEVICE AND LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide a thin coil device which has the high strength of adhesion and can prevent the performance deterioration, appearance defect, and yield of its product caused by the leakage of an adhesive. SOLUTION: First and second metallic-sheet terminals 2 and 3 are fitted to the external surface of a first flange 12 with an interval between. First and second projecting edges (22 and 32) and (23 and 33) rise from the peripheral edges of core receiving sections 21 and 31 on opposite sides and bonded to the outer periphery of the first flange 12 with adhesives 51 and 52 applied to the outer periphery with an interval of≤G2 between. Tying-up terminals 24 and 34 adjoin the second projecting edges 23 and 33. Outside connecting terminals 25 and 35 are extended from the core receiving sections 21 and 31 and have bent sections 26 and 36 at their front ends. A coil 4 is wound around a coil winding section 11 and terminals of the coil 4 are tied up and connected to the tying-up terminals 24 and 34. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347131(A) 申请公布日期 2003.12.05
申请号 JP20020149655 申请日期 2002.05.23
申请人 TDK CORP 发明人 SHOJI ATSUSHI
分类号 H01F27/29;(IPC1-7):H01F27/29 主分类号 H01F27/29
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