| 摘要 |
<p>The chip card comprises a chip (2) and memory components (21,32) mounted in a cavity of card underneath a sticker (1) closing the cavity so that the sticker has conducting zones (6-13) on upper surface (3), which can be connected to a reader of chip card. The memory components are connected to the chip by conducting zones, and connections which include wires (16,23,26,27,29) and a strip conductor (24) are on lower surface (4) of sticker, so as to connect each conducting zone of upper surface to the chip by use of connection wells (14,22,25,28,30). The chip is connected to the memory components by the intermediary of a conducting zone (13), which is not used in the chip card reading. The sticker (1) comprises an insulator substrate and connection wells (14,22,25,28,30) through the substrate which connect wires to conducing zones. The same conducting zone (13) of upper surface comprises several, e.g. two, connection wells (28,30). The chip and/or memory component comprises a support which can be bonded underneath several conducting zones of sticker, or are bonded underneath one conducting zone of sticker. The conducting zones of upper surface are extended and increase the area of sticker. The chip card comprises two memory components (21,32), which are independently connected to the chip (2). The chip has a maximum size of 6 mm x 5mm, and is connected to a memory component of maximum size 6mm x 4mm. The chip has a size of 6mm x 4.4mm and is connected to two memory components, each of size 5mm x 2mm.</p> |
