| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide wafer fixing pellets and a semiconductor wafer processing method using the same wherein a semiconductor wafer is brought into close contact with a base such as a hard plate, an elastic carrier (packing material), or a wafer and fixed so as to be held when the wafer is processed, the wafer as a work is easily separated, a fixing agent layer attached to the wafer is easily removed, the wafer is easily cleaned, and the wafer as the work is kept free from contamination. <P>SOLUTION: The wafer fixing pellets contain liquid crystal compounds. The pellets interposed between the semiconductor wafer and the base where the wafer is fixed are heated to be melted, and the wafer and the base are brought into close contact with each other and fixed with each other. After the exposed surface of the wafer is subjected to processing, the wafer is separated from the base and cleaned. <P>COPYRIGHT: (C)2004,JPO |
