发明名称 BONDING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To carry out bonding of high quality without increasing the inertia of a bonding arm even in a wide bonding area. <P>SOLUTION: A bonding arm 103 is fixed to a roller bearing 106 of a bonding head base 102 by means of its spindle 103A. Since the center of an arc of the arched roller bearing 106 which fixes the bonding arm 103 to the bonding head base 102 is at a lower position than the bonding head 101, it is possible to carry out bonding with the bonding head 101 disposed above a bonding surface 107. Therefore, it is not necessary to make the bonding arm longer even in a wide bonding area and the inertia of the bonding arm is not increased. Bonding of high quality can be performed by positioning the center of the arc of the roller bearing 106 inside the bonding surface 107 and allowing the tip of the bonding head 101 to come into vertical contact with the bonding surface 107 and to be pressurized vertically. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003347349(A) 申请公布日期 2003.12.05
申请号 JP20020156706 申请日期 2002.05.30
申请人 NEC CORP 发明人 YAMAGUCHI TOSHIAKI;HANAWA YASUHIRO
分类号 F16C19/04;F16C32/04;F16C32/06;H01L21/60;H01L21/607 主分类号 F16C19/04
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